2024 International Conference on Mechanical Materials and Computer Engineering

WELCOME TO MMCE 2024 !
  • 58
    DAY
  • 18 HOUR
  • 23 MINUTE
  • 33 SECONDS
IMPORTANT DATES
  • 1
  • 2
  • 3
  • 4
  • Submission Deadline 2024-08-28
  • Registration Deadline 2024-09-04
  • Conference Date 2024-09-11
  • Notification Date About a week after the submission
- About to MMCE 2024-
The Second International Conference on Machinery, Materials and Computer Engineering is an international event aimed at promoting academic exchange and cooperation in the field of machinery, materials and computer engineering. The conference brings together experts, scholars, researchers, and business representatives from around the world to discuss the latest research achievements, technological innovation, and future development trends in this field. The conference spans three major fields: machinery, materials, and computer engineering, providing participants with a rich interdisciplinary communication platform, promoting the collision and integration of ideas between different fields. The conference topics closely follow the forefront of international academic research, covering the latest research achievements and technological progress in various fields such as mechanical engineering, materials science, and computer engineering. All submitted papers must go through a strict expert review process to ensure their academic quality and innovation. The accepted papers will be included in the conference proceedings and have the opportunity to be indexed by internationally renowned databases to enhance academic influence. During the conference, multiple thematic forums and seminars will be held, inviting authoritative experts in the field to give keynote speeches and share the latest research results and academic insights. This will be a high-level international academic event. Attendees will have the opportunity to gain a deeper understanding of the latest developments and cutting-edge technologies in this field, expand their academic horizons and network resources, and lay a solid foundation for future scientific research and cooperation.
- CALL FOR PAPERS -
(Including but not limited to the following topics)
Mechanics: Mechanical dynamics and vibration Strength of mechanical components Mechanical transmission design Mechanical structure design Rolling bearing Casting Technology and Equipment Heat treatment technology and equipment Cutting Technology and Equipment Special processing technology and equipment Special processing technology and equipment Metal and non-metal processing CNC Technology and CNC Machine Tools Hydraulic Drive and Control Instruments and Apparatuses Vehicle dynamic performance simulation Energy machinery equipment Metallurgical machinery and its automation Engineering machinery and equipment Aircraft Structure and Design Spacecraft Structure and Design Intelligent Mechatronics Integration and Robot Technology Precision Manufacturing and Measurement Material Science: 3D printing and additive manufacturing semiconductor material Thin film materials Surface Engineering/Coating Deformation Mechanics and Fracture of Materials The surface and interface of materials Material calculation and numerical simulation Material processing and forming technology Electronic, electrochemical, optical, mechanical, and magnetic materials compound material Engineering Materials and Technology Advanced synthesis methods for functional materials Laser processing technology Computational Materials Science building material Metallic materials Precision and ultra precision machining technology Energy, Resources, Environment, and Health Applications biological materials ceramics Micro/nano materials Microelectronic Sealing Measurement and Manufacturing Technology Characterization of advanced materials Phase Change and New Material Theory New energy materials Additive manufacturing technology Energy storage and conversion materials Intelligent manufacturing technology Insulation materials Environmentally friendly materials Seismic resistant materials and design Polymer materials Material corrosion and surface treatment technology Mold testing and evaluation of materials Computer Engineering: numerical analysis operating system Programming Paradigm Quantum computing theory Scientific computing computer programming Database management system Evolutionary computing Logic programming machine learning software engineering software test Symbolic Mathematics Advanced adaptive signal processing Spectrum estimation and modeling TF spectrum analysis and wavelet analysis High order spectral analysis Adaptive filtering&SP Array signal processing Hardware Implementation of Signal Processing Speech and audio encoding Speech synthesis and recognition Image processing and understanding Information ocean technology Partial differential equations for image processing Video compression and streaming Computer Vision and VR Multimedia and human-computer interaction Statistical Learning and Pattern Recognition Artificial Intelligence and Neural Networks Communication signal processing
-record-
All full paper submissions to the www.icmmce.com could be written in English and will be sent to at least two reviewers and evaluated based on originality, technical or research content or depth, correctness, relevance to conference, contributions, and readability. All accepted papers of www.icmmce.com will be published in the conference proceedings, which will be submitted to EI Compendex, Scopus for indexing.
-Submission Portal-
If you have any question or need any assistance regarding the conference, please feel free to contact our conference specialists:
姚老师 | TEL:19980549140 (微信同号) | QQ:1912800772 | E-mail:mmce@sub-paper.com |
Submission Guidelines

Paper template

Please refer to the paper template for layout

Click to download >>

Register

All attendees must register in advance to attend the meeting

Consulting service >>

Submit

Please submit the full text/abstract of the paper to us through the electronic submission system

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Indexing Service
Technical Sponsor

中文特别声明

出版社在论文出版前会对论文重复率进行检测,重复率大于20%的稿件将被拒绝出版;重复率不大于20%的稿件中,如有整段大面积的直接复制其他作者文章内容的情况,也会被拒绝出版。以上两种涉及抄袭的情况,一旦被出版社证实,文章将被拒绝出版,并且不退回任何会议注册费用。

-About Plagiarism Check-

Crosscheck Powered by iThenticate will be used for plagiarism check. The amount of duplication from previously published content should be less than 20%; If the amount of duplication is 20% - 35%, modification maybe required; if the amount of duplication exceeds 35%, the article will be rejected. Please note that there will be no refund for no-shows.
Call for Reviewers
As a platform for global academic communication, the quality of conference publication has always an aspect attracting much of our attention. To ensure quality of our publication and to better serve the peers in academic circle, we now call for reviewers among professionals and experts of the world. Professionals and experts who hold PhD (doctoral) degree in the conference related areas are encouraged to join in us and together, we will work hard to become a world-class academic conference. Please send us your CV by email (mmce@sub-paper.com) if you are interested in it.
SCI JOURNAL
Contributors are encouraged to submit papers / abstracts to the conference. The organizing committee will select high-quality papers and recommend them to SCI/SSCI journals. For specific matters, please contact the person in charge of the conferrence.
Submission Guidelines
Delegates are encouraged to submit their papers/abstracts to the conference. Good quality papers will be selected by the organizing committee and Prof. Soteris Kalogirou, the editor in chief. After it, the authors will be invited to extent their papers/abstracts and submit them to mmce@sub-paper.com. The normal size of research papers is 4,000-6,000 words excluding abstract and references.